TSL238D-TR【PDF 12/13 页】IC LIGHT TO FREQUENCY CONV 8SOIC

TSL238

HIGH-SENSITIVITY

LIGHT-TO-FREQUENCY CONVERTER

TAOS073J SEPTEMBER 2008

The LUMENOLOGY r Company

www.taosinc.com

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and

vaporization of moisture that has been previously absorbed into the package molding compound. To prevent

these adverse conditions, all devices shipped in carrier tape have been pre-baked and shipped in a sealed

moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within

24 hours of the seal being broken on the moisture-barrier bag.

However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours

or longer, it is recommended that the following procedures be used to ensure the package molding compound

contains the smallest amount of absorbed moisture possible.

For devices shipped in tubes:

1. Remove devices from tubes

2. Bake devices for 4 hours, at 90癈

3. After cooling, load devices back into tubes

4. Perform solder reflow within 24 hours after bake

Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be

re-baked for 4 hours, at 90癈 for a cumulative total of 12 hours (3 bakes for 4 hours at 90癈).

For devices shipped in carrier tape:

1. Bake devices for 4 hours, at 90癈 in the tape

2. Perform solder reflow within 24 hours after bake

Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be

rebaked for 4 hours in tape, at 90癈 for a cumulative total of 12 hours (3 bakes for 4 hours at 90癈).

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